Product Details:
Payment & Shipping Terms:
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| Material: | WCu, MoCu, CMC, CPC | Hermecity: | Excellent Hermecity |
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| Stablity: | Good Thermal Shock Stability | Application: | Flanges For Hermetic Package Or Heat Sink For Chip Submounts |
| High Light: | molybdenum copper heat spreaders,copper molybdenum heat base |
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Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)
Descriptions:
Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Copper Tungsten, Molybdenum Copper, Cu/Mo/Cu, Cu/MoCu/Cu are popular refractory metals based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.
By adjusting the content of content, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Advantages:
o High thermal conductivity
o Excellent hermeticity
o Excellent flatness, surface finish, and size control
o Semi-finished or finished (Ni/Au plated) products available
Applications:
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
