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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

Certification
Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

China High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages supplier
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages supplier High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages supplier

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Product Details:

Place of Origin: China
Brand Name: JBNR
Certification: ISO9001
Model Number: HCCP001

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: Wooden packages
Payment Terms: D/P,L/C, T/T, Western Union
Supply Ability: 5ton per month
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Detailed Product Description
Material: CPC111, CPC232, CPC141, CPC300 Surface: Polished, Shiny, Good Surface Roughness
Plating: Nickel Or Gold Plating Offer: Plate, Sheet, Fabricated Parts

Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages

 

Description:

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

 

Product Properties:

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CPC141 9.5 7.3 280(XY)/170(Z)

 

 

Application:

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.

High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

 

Related Products:

We also offer tungsten copper heat sink (WCu), molybdenum copper (MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum copper copper (Cu/MoCu/Cu) sheets or fabricated parts for microelectronics packaging and power devices.

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: admin

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