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200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
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The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

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200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation

China 200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation supplier
200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation supplier 200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation supplier

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Product Details:

Place of Origin: China
Brand Name: JBNR
Certification: ISO9001
Model Number: HCWC005

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: Wooden packages
Payment Terms: D/P,L/C, T/T, Western Union
Supply Ability: 5ton per month
Detailed Product Description
Material: W90Cu10 , W85Cu15 , W80Cu20, W75Cu25, W70Cu30 Surface: Cold Rolled, Polished, Shiny
Plating: Nickel Or Gold Plating Offer: Plate, Cube , Sheet , Fabricated Parts
Hermeticity: Low Porosity
High Light:

molybdenum copper heat spreaders

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copper molybdenum heat base

200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation

 

Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.

 

Advantages:

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low porosity

 

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

 

200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: admin

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