Product Details:
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| Material: | Tungsten Copper | Density: | 14.9 |
|---|---|---|---|
| CTE: | 9.0 | TC: | 220 |
| Application: | Hermetic Packages | Color: | Silver Or Gold |
| High Light: | molybdenum copper heat spreaders,tungsten copper heat spreader |
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W75Cu25 Tungsten Copper Heat Sink Spreader ,Copper Molybdenum Heat Base With Nickel Plating
Description:
(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Product picture:
