Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate
CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.
CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
|Grade||W Content||Density g/cm3|
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
|90WCu||90±2%||17.0||6.5||180 (25℃) /176 (100℃)|
|85WCu||85±2%||16.4||7.2||190 (25℃) / 183 (100℃)|
|80WCu||80±2%||15.65||8.3||200 (25℃) / 197 (100℃)|
|75WCu||75±2%||14.9||9.0||230 (25℃) / 220 (100℃)|
|50WCu||50±2%||12.2||12.5||340 (25℃) / 310 (100℃)|
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.