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Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate

China Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate supplier
Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate supplier Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate supplier

Large Image :  Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
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Detailed Product Description
Material: Tungsten Copper Density: 16.4
CTE: 7.2 TC: 185
Brand: JBNR Application: Laser Diode Submounts

Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate
 
Description:
 
CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.
 
CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
 
Advantages:
 
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
 
Product Properties:

GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)
     
     

Application:
 
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
 
Product picture:
Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate

 

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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