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| Material: | Copper/moly/copper | Density: | 9.32 |
|---|---|---|---|
| CTE: | 8.8 | TC: | 250 |
| Application: | RF And Microwave Industry | ||
| High Light: | copper base plate,copper block heat sink |
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Cu/Mo/Cu CMC111 heat spreader for RF and Microwave Amplifiers
Description:
CMC or CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core layer and two copper clad layers . They have different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu.
| Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
| CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
| CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
| CMC141 | 9.75 | 6.0 | 220(XY)/180(Z) |
| CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |
Application:
Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
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