Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
Nickel Plated Gold Plated Good Lamination Cu/Mo70Cu/Cu Carriers In High Power Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad ... Read More
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging Description: Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated ... Read More
MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE Description: Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and ... Read More
High-tech MoCu Electronic Packaging Materials With Silver Plating Description: The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good ... Read More
Nickel Plated Gold Plated Free Of Surface Defects WCu, MoCu, CMC, CPC Base Plates Flanges Descriptions: Packaging materials strongly effect the effectiveness of an electronic packaging system regarding ... Read More
W85Cu15 Flange For Hermetic Packages/RF Packages/Opto Packages Description: Electronic packaging material are requested certain mechanical strength, good electrical properties, thermal properties and chemical ... Read More
High Thermal Expansion Mocu Flanges For Microwave Packages In Microelectro Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficien... Read More
200 Thermal Conductivity 4" W85Cu Substrate For High Power Led Dissipation Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage. ... Read More
Cu/Mo/Cu CMC111 heat spreader for RF and Microwave Amplifiers Description: CMC or CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core ... Read More
Cu-W Heat Spreader Material for Ceramic Packages CuW Electronic thermal management materials Description: Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today.With ... Read More